Total Solution Company Value Engineering





| E-beam | Sputter | H100, H200 | |
|---|---|---|---|
| Principle | A method of evaporating the coating material and depositing it on the substrate |
Deposits the protruding target particles by bombarding the ions in the plasma with the target material. |
Ion-assisted control + sputtering deposition → Nanolattice Control Coatings |
| Vapor Deposition | Vapor(Liquid) | Atomic | Atomic + Ionic |
| Confomality | Good | Good | Excellent |
| Adhesion to Substrate | Bad | Good | Excellent |
| Precision | Good | Good | Excellent |
| Hardness | Bad | Good | Excellent |
| Thermal Stability | Bad | Good | Excellent |
| Light Transmittance | Good | Good | Excellent |

